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Silver-Coated Copper Powder with Core-Shell Structure

A dense silver layer is formed on the surface of ultrafine copper powder by chemical replacement method, forming silver-copper composite structure, which combines the excellent electrical conductivity of silver with the cost-effectiveness of copper, achieving an interfacial bonding strength of over 200MPa.

Keywords:Kemexc

Description

A dense silver layer is formed on the surface of ultrafine copper powder by chemical replacement method, forming silver-copper composite structure, which combines the excellent electrical conductivity of silver with the cost-effectiveness of copper, achieving an interfacial bonding strength of over 200MPa.
Quality Indicators

Model KK-SCCP
Core Material Electrolytic Copper Powder (Purity ≥ 99.9%)
Thickness of Silver Layer 170nm-1μm (adjustable)
Silver 5-50wt%
Particle Size Distribution D50:1-20μm
Resistivity ≤5×10⁻⁶Ω·m
Place of Origin Henan, China

Application Field
5G Filter Conductive Adhesive
Electromagnetic Shielding Composite Material
Photovoltaic Backsheet Conductive Coatings
Low-cost Surface Mounted Devices(SMD) Electronics

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