
Silver-Coated Copper Powder with Core-Shell Structure
Keywords:Kemexc
Category:
Description
A dense silver layer is formed on the surface of ultrafine copper powder by chemical replacement method, forming silver-copper composite structure, which combines the excellent electrical conductivity of silver with the cost-effectiveness of copper, achieving an interfacial bonding strength of over 200MPa.
Quality Indicators
Model | KK-SCCP |
Core Material | Electrolytic Copper Powder (Purity ≥ 99.9%) |
Thickness of Silver Layer | 170nm-1μm (adjustable) |
Silver | 5-50wt% |
Particle Size Distribution | D50:1-20μm |
Resistivity | ≤5×10⁻⁶Ω·m |
Place of Origin | Henan, China |
Application Field
5G Filter Conductive Adhesive
Electromagnetic Shielding Composite Material
Photovoltaic Backsheet Conductive Coatings
Low-cost Surface Mounted Devices(SMD) Electronics
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